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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | Core Size | |
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NXP USA Inc. |
450
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 208MAPBGA
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Tray | HCS12X | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | LVD，POR，PWM，WDT | HCS12X | 152 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 450 MPQ: 1
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IC MCU 16BIT 1MB FLASH 208MAPBGA
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Tray | HCS12X | -40°C ~ 85°C (TA) | 208-BGA | 208-MAPBGA (17x17) | LVD，POR，PWM，WDT | HCS12X | 152 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
|
IC MCU 16BIT 1MB FLASH 208MAPBGA
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Tray | HCS12X | -40°C ~ 85°C (TA) | 208-BGA | 208-MAPBGA (17x17) | LVD，POR，PWM，WDT | HCS12X | 152 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 1MB FLASH 176LQFP
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Tape & Reel (TR) | TC116x | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 133MHz | 128K x 8 | 1MB (1M x 8) | Flash | - | 1.42 V ~ 1.58 V | ASC，CANbus，EBI/EMI，MLI，MSC，SSC | 32-Bit | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 162 MPQ: 1
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IC MCU 32BIT 8KB ROM 329BGA
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Tray | TC17xx | -40°C ~ 125°C (TA) | 329-BBGA | 329-PBGA (31x31) | POR，WDT | TriCore | 176 | 40MHz | 73K x 8 | 8KB (8K x 8) | ROM | - | 2.3 V ~ 2.75 V | CANbus，EBI/EMI，SDLM，SSC，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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16-BIT MCU S12X CORE 1MB FLASH
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Tray | HCS12X | -40°C ~ 85°C (TA) | 208-BGA | 208-MAPBGA (17x17) | LVD，POR，PWM，WDT | HCS12X | 152 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit |
