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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Data Converters | Connectivity | |
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NXP USA Inc. |
1,307
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 324TEPBGA
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Tray | MPC51xx | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA，WDT | e300 | 64 | 400MHz | 32K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
196
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 516FPBGA
|
Tray | MPC5121e | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
TELEMATICS PROCESSOR W/O MBX GRA
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Tray | MPC5123 | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 800 MPQ: 1
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IC MCU 32BIT ROMLESS 225MAPBGA
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Tray | MCF525x | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | - | 140MHz | 128K x 8 | A/D 6x12b | ATA，Audio，CANbus，EBI/EMI，I2C，IDE，SD，SPI，UART/USART，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 800 MPQ: 1
|
IC MCU 32BIT ROMLESS 225MAPBGA
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Tray | MCF525x | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | - | 140MHz | 128K x 8 | A/D 6x12b | ATA，Audio，CANbus，EBI/EMI，I2C，IDE，SD，SPI，UART/USART，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT ROMLESS 324TEPBGA
|
Tape & Reel (TR) | MPC51xx | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA，WDT | e300 | 64 | 400MHz | 32K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT ROMLESS 324BGA
|
Tape & Reel (TR) | MPC51xx | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA，WDT | e300 | 64 | 400MHz | 32K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT ROMLESS 516TEPBGA
|
Tray | MPC5121e | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT ROMLESS 516FPBGA
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Tray | MPC5123 | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT ROMLESS 516FPBGA
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Tray | MPC5121e | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 120 MPQ: 1
|
IC MCU 32BIT ROMLESS 516FPBGA
|
Tray | MPC5123 | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 40 MPQ: 1
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IC MCU 32BIT ROMLESS 516FPBGA
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Tray | MPC51xx | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，WDT | e300 | 147 | 400MHz | 128K x 8 | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
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AMADEUS+USB
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Tape & Reel (TR) | MCF525x | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | - | 140MHz | 128K x 8 | A/D 6x12b | ATA，Audio，CANbus，EBI/EMI，I2C，IDE，SD，SPI，UART/USART，USB OTG |
