- Packaging:
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- Operating Temperature:
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Discover 101 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | ||
NXP USA Inc. |
963
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
2,280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
534
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
679
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
840
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
413
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
287
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
466
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
510
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
284
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
405
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
370
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
519
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
111
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI |