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Discover 14 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
1,348
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 256MAPBGA
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Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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Renesas Electronics America |
39
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 256BGA
|
Tray | SuperH SH7750 | -40°C ~ 85°C (TA) | 256-BBGA | 256-BGA (27x27) | DMA，POR，WDT | SH-4 | 39 | 48K x 8 | - | ROMless | - | 1.4 V ~ 1.6 V | - | EBI/EMI，FIFO，SCI，SmartCard | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 292LFBGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA，POR，WDT | TriCore | 128 | 288K x 8 | 4MB (4M x 8) | Flash | 192K x 8 | 1.17 V ~ 3.63 V | A/D 8x10b，44x12b | ASC，CANbus，FlexRay，MLI，MSC，SSC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 630 MPQ: 1
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IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF537x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，POR，PWM，WDT | Coldfire V3 | 62 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 630 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 630 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF537x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，POR，PWM，WDT | Coldfire V3 | 62 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 630 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF537x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，POR，PWM，WDT | Coldfire V3 | 62 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
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Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 126 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF537x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，POR，PWM，WDT | Coldfire V3 | 62 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 126 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF537x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，POR，PWM，WDT | Coldfire V3 | 62 | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG |
