Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed RAM Size Program Memory Size Voltage - Supply (Vcc/Vdd) Data Converters Connectivity Core Size
DSP56F826BU80E
NXP USA Inc.
900
3 days
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MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 100LQFP
Tray 56F8xx -40°C ~ 85°C (TA) 100-LQFP 100-LQFP (14x14) POR,WDT 56800 80MHz 4K x 16 64KB (32K x 16) 2.25 V ~ 2.75 V - EBI/EMI,SCI,SPI,SSI 16-Bit
SM470R1B1MHFQS
Texas Instruments
264
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1MB FLASH 84CFP
Bulk TMS470 -55°C ~ 220°C (TA) 84-CBFQFP Exposed Pad and Tie Bar 84-CFP DMA,POR,PWM,WDT ARM7 60MHz 64K x 8 1MB (1M x 8) 1.71 V ~ 2.05 V A/D 12x10b CANbus,I2C,SCI,SPI 16/32-Bit
SM470R1B1MHKPS
Texas Instruments
Inquiry
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MOQ: 1  MPQ: 1
IC MCU 32BIT 1MB FLASH 84CFP
Tray TMS470 -55°C ~ 220°C (TA) 84-BCQFP Exposed Pad 84-CFP (13.8x13.8) DMA,POR,PWM,WDT ARM7 60MHz 64K x 8 1MB (1M x 8) 1.71 V ~ 2.05 V A/D 12x10b CANbus,I2C,SCI,SPI 16/32-Bit
SM470R1B1MPGES
Texas Instruments
Inquiry
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MOQ: 60  MPQ: 1
IC MCU 32BIT 1MB FLASH 144LQFP
Tray TMS470 -55°C ~ 150°C (TA) 144-LQFP 144-LQFP (20x20) DMA,POR,PWM,WDT ARM7 60MHz 64K x 8 1MB (1M x 8) 1.71 V ~ 2.05 V A/D 12x10b CANbus,I2C,SCI,SPI 16/32-Bit
DSP56F826BU80
NXP USA Inc.
Inquiry
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MOQ: 90  MPQ: 1
IC MCU 16BIT 64KB FLASH 100LQFP
Tray 56F8xx -40°C ~ 85°C (TA) 100-LQFP 100-LQFP (14x14) POR,WDT 56800 80MHz 4K x 16 64KB (32K x 16) 2.25 V ~ 2.75 V - EBI/EMI,SCI,SPI,SSI 16-Bit
SM470R1B1MKGDS1
Texas Instruments
Inquiry
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MOQ: 36  MPQ: 1
IC MCU 32BIT 1MB FLASH 0XCEPT
Tube TMS470 -55°C ~ 220°C (TA) Die 0-XCEPT DMA,POR,PWM,WDT ARM7 60MHz 64K x 8 1MB (1M x 8) 1.71 V ~ 2.05 V A/D 12x10b CANbus,I2C,SCI,SPI 16/32-Bit