- Manufacturer:
-
- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Peripherals:
-
- Core Processor:
-
- RAM Size:
-
- Program Memory Size:
-
- Program Memory Type:
-
- EEPROM Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Connectivity:
-
- Core Size:
-
- Selected conditions:
Discover 51 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
407
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA,I2S,LCD,PWM,WDT | ARM926EJ-S | 180MHz | 192K x 8 | - | ROMless | - | 1.1 V ~ 3.6 V | A/D 4x10b | EBI/EMI,I2C,Memory Card,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
Analog Devices Inc. |
185
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 96BGA
|
Tray | ADuCM | -40°C ~ 105°C (TC) | 96-TFBGA,CSPBGA | 96-CSPBGA (6x6) | POR,PWM,WDT | ARM Cortex-M3 | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.9 V ~ 3.6 V | A/D 16x12b,D/A 8x12b | I2C,MDIO,SPI | 32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64TQFP
|
Tape & Reel (TR) | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 48K x 8 | 512KB (512K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
STMicroelectronics |
810
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64TQFP
|
Cut Tape (CT) | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 48K x 8 | 512KB (512K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
STMicroelectronics |
810
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64TQFP
|
- | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 48K x 8 | 512KB (512K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
Analog Devices Inc. |
73
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 96BGA
|
Tray | ADuCM | -40°C ~ 105°C (TC) | 96-TFBGA,CSPBGA | 96-CSPBGA (6x6) | POR,PWM,WDT | ARM Cortex-M3 | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.9 V ~ 3.6 V | A/D 16x12b,D/A 8x12b | I2C,MDIO,SPI | 32-Bit | ||||
NXP USA Inc. |
52
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA,I2S,LCD,PWM,WDT | ARM926EJ-S | 180MHz | 96K x 8 | - | ROMless | - | 1.1 V ~ 3.6 V | A/D 4x10b | EBI/EMI,I2C,Memory Card,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64TQFP
|
Tape & Reel (TR) | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 960 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64TQFP
|
Tray | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 48K x 8 | 512KB (512K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
STMicroelectronics |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64TQFP
|
Tray | Automotive,AEC-Q100,SPC57 S | -40°C ~ 125°C (TJ) | 64-TQFP Exposed Pad | 64-eTQFP | DMA,POR,WDT | e200z0h | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | 32K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus,LINbus,SPI,UART/USART | 32-Bit | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 96BGA
|
Tape & Reel (TR) | ADuCM | -40°C ~ 105°C (TC) | 96-TFBGA,CSPBGA | 96-CSPBGA (6x6) | POR,PWM,WDT | ARM Cortex-M3 | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.9 V ~ 3.6 V | A/D 16x12b,D/A 8x12b | I2C,MDIO,SPI | 32-Bit | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 96BGA
|
Tape & Reel (TR) | ADuCM | -40°C ~ 105°C (TC) | 96-TFBGA,CSPBGA | 96-CSPBGA (6x6) | POR,PWM,WDT | ARM Cortex-M3 | 80MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.9 V ~ 3.6 V | A/D 16x12b,D/A 8x12b | I2C,MDIO,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 32BIT ROMLESS 225MAPBGA
|
Tray | MCF525x | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 128K x 8 | - | ROMless | - | 1.08 V ~ 3.6 V | A/D 6x12b | ATA,Audio,CANbus,EBI/EMI,I2C,IDE,SD,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 32BIT ROMLESS 225MAPBGA
|
Tray | MCF525x | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 128K x 8 | - | ROMless | - | 1.08 V ~ 3.6 V | A/D 6x12b | ATA,Audio,CANbus,EBI/EMI,I2C,IDE,SD,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 32BIT ROMLESS 225MAPBGA
|
Tray | MCF525x | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA,WDT | Coldfire V2 | 140MHz | 128K x 8 | - | ROMless | - | 1.08 V ~ 1.32 V | A/D 6x12b | CANbus,EBI/EMI,I2C,QSPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 32BIT ROMLESS 225MAPBGA
|
Tray | MCF525x | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA,WDT | Coldfire V2 | 140MHz | 128K x 8 | - | ROMless | - | 1.08 V ~ 1.32 V | A/D 6x12b | CANbus,EBI/EMI,I2C,QSPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 47 MPQ: 1
|
IC MCU 8BIT 6KB FLASH 16SOIC
|
Tube | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295",7.50mm Width) | 16-SOIC | - | HC08 | - | - | 6KB (6K x 8) | Flash | - | - | - | - | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC MCU 8BIT 6KB FLASH 16TSSOP
|
Tube | HC08 | -40°C ~ 125°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | - | HC08 | - | - | 6KB (6K x 8) | Flash | - | - | - | - | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC MCU 8BIT 6KB FLASH 16TSSOP
|
Tube | HC08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | - | HC08 | - | - | 6KB (6K x 8) | Flash | - | - | - | - | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 64LQFP
|
Tray | HC08 | 0°C ~ 70°C (TA) | 64-LQFP | 64-LQFP (10x10) | - | HC08 | - | - | 32KB (32K x 8) | Flash | - | - | - | - | 8-Bit |