EEPROM Size:
Discover 44 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Supplier Device Package Peripherals Core Processor Number of I/O Speed RAM Size Program Memory Size EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Connectivity
MPC5566MVR132
NXP USA Inc.
622
3 days
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MOQ: 1  MPQ: 1
IC MCU 32BIT 3MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5674FF3MVR3
NXP USA Inc.
194
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 4MB FLASH 416BGA
Tray MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 264MHz 256K x 8 4MB (4M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5566MZP132
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5566MZP144
NXP USA Inc.
200
3 days
-
MOQ: 1  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 144MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
MPC5553MZP132
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 220 132MHz 64K x 8 1.5MB (1.5M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
MPC5553MVR132
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 220 132MHz 64K x 8 1.5MB (1.5M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
MPC5554MZP80
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 2MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 82MHz 64K x 8 2MB (2M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,SCI,SPI
MPC5554MZP132R2
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
IC MCU 32BIT 2MB FLASH 416BGA
Tape & Reel (TR) MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 64K x 8 2MB (2M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,SCI,SPI
MPC5554MVR132
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 2MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 64K x 8 2MB (2M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,SCI,SPI
MPC5554MZP132
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 2MB FLASH 416BGA
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 64K x 8 2MB (2M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,SCI,SPI
SPC5566MZP80R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 80MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5673FF3MVR2R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 200MHz 192K x 8 3MB (3M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5673FK0MVR2R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
3M FLASH 256K RAM Z7 200MHZ
Tape & Reel (TR) MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 200MHz 192K x 8 3MB (3M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5566MZP80
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 80MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5673FF3MVR2
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 200MHz 192K x 8 3MB (3M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5673FK0MVR2
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
3M FLASH 256K RAM Z7 200MHZ
Tray MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 200MHz 192K x 8 3MB (3M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5566MZP112R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 112MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5673FF3MVR3
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 3MB FLASH 416BGA
Tray MPC56xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM e200z7 32 264MHz 192K x 8 3MB (3M x 8) - 1.08 V ~ 5.25 V A/D 64x12b CANbus,SCI,SPI
SPC5566MVR132R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) MPC55xx Qorivva -40°C ~ 105°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI
SPC5566MZP132R
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) MPC55xx Qorivva -40°C ~ 125°C (TA) 416-PBGA (27x27) DMA,POR,PWM,WDT e200z6 256 132MHz 128K x 8 3MB (3M x 8) - 1.35 V ~ 1.65 V A/D 40x12b CANbus,EBI/EMI,Ethernet,SCI,SPI