Discover 11 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O Speed RAM Size Core Size
XE232-1024-FB374-I40
XMOS
Inquiry
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MOQ: 84  MPQ: 1
IC MCU 32BIT ROMLESS 374FBGA
-40°C ~ 85°C (TA) 374-LFBGA 374-FBGA (18x18) 176 4000MIPS 1M x 8 32-Bit 32-Core
XE232-512-FB374-C40
XMOS
Inquiry
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-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 374FBGA
0°C ~ 70°C (TA) 374-LFBGA 374-FBGA (18x18) 176 4000MIPS 512K x 8 32-Bit 32-Core
XE216-512-FB236-C20
XMOS
123
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 236FBGA
0°C ~ 70°C (TA) 236-LFBGA 236-FBGA (10x10) 73 2000MIPS 512K x 8 32-Bit 16-Core
XE216-512-TQ128-I20
XMOS
60
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 128TQFP
-40°C ~ 85°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) 67 2000MIPS 512K x 8 32-Bit 16-Core
XE216-512-TQ128-C20
XMOS
401
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 128TQFP
0°C ~ 70°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) 67 2000MIPS 512K x 8 32-Bit 16-Core
XE232-1024-FB374-C40
XMOS
252
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 374FBGA
0°C ~ 70°C (TA) 374-LFBGA 374-FBGA (18x18) 176 4000MIPS 1M x 8 32-Bit 32-Core
XE216-512-FB236-I20
XMOS
Inquiry
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-
MOQ: 168  MPQ: 1
IC MCU 32BIT ROMLESS 236FBGA
-40°C ~ 85°C (TA) 236-LFBGA 236-FBGA (10x10) 73 2000MIPS 512K x 8 32-Bit 16-Core
XE216-256-FB236-C20
XMOS
Inquiry
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-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 236FBGA
0°C ~ 70°C (TA) 236-LFBGA 236-FBGA (10x10) 73 2000MIPS 256K x 8 32-Bit 16-Core
XE216-256-FB236-I20
XMOS
Inquiry
-
-
MOQ: 168  MPQ: 1
IC MCU 32BIT ROMLESS 236FBGA
-40°C ~ 85°C (TA) 236-LFBGA 236-FBGA (10x10) 73 2000MIPS 256K x 8 32-Bit 16-Core
XE216-256-TQ128-C20
XMOS
Inquiry
-
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 128TQFP
0°C ~ 70°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) 67 2000MIPS 256K x 8 32-Bit 16-Core
XE216-256-TQ128-I20
XMOS
Inquiry
-
-
MOQ: 90  MPQ: 1
IC MCU 32BIT ROMLESS 128TQFP
-40°C ~ 85°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) 67 2000MIPS 256K x 8 32-Bit 16-Core