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Discover 1,745 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Infineon Technologies |
1,000
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3 days |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 2MB FLASH 100TQFP
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Tape & Reel (TR) | AURIX | -40°C ~ 125°C (TA) | 100-TQFP Exposed Pad | 100-TQFP (12x12) | DMA，WDT | TriCore | 78 | 200MHz | 192K x 8 | 2MB (2M x 8) | Flash | 128K x 8 | 3.3V | A/D 24x12b | CANbus，FlexRay，LINbus，QSPI | ||
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Infineon Technologies |
1,620
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 100TQFP
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Cut Tape (CT) | AURIX | -40°C ~ 125°C (TA) | 100-TQFP Exposed Pad | 100-TQFP (12x12) | DMA，WDT | TriCore | 78 | 200MHz | 192K x 8 | 2MB (2M x 8) | Flash | 128K x 8 | 3.3V | A/D 24x12b | CANbus，FlexRay，LINbus，QSPI | ||
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Infineon Technologies |
1,620
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 100TQFP
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- | AURIX | -40°C ~ 125°C (TA) | 100-TQFP Exposed Pad | 100-TQFP (12x12) | DMA，WDT | TriCore | 78 | 200MHz | 192K x 8 | 2MB (2M x 8) | Flash | 128K x 8 | 3.3V | A/D 24x12b | CANbus，FlexRay，LINbus，QSPI | ||
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Texas Instruments |
3,374
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 176HQFP
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Tray | C2000 C28x Piccolo | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA，POR，PWM，WDT | C28x | 97 | 120MHz | 50K x 16 | 512KB (256K x 16) | Flash | - | 1.14 V ~ 3.47 V | A/D 17x12b，D/A 3x12b | CANbus，EBI/EMI，I2C，McBSP，SCI，SPI，UART/USART，USB | ||
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Texas Instruments |
3,721
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100QFP
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Tray | C2000 C28x Piccolo | -40°C ~ 105°C (TA) | 100-TQFP Exposed Pad | 100-HTQFP (14x14) | DMA，POR，PWM，WDT | C28x | 41 | 120MHz | 50K x 16 | 512KB (256K x 16) | Flash | - | 1.14 V ~ 3.47 V | A/D 14x12b，D/A 3x12b | CANbus，EBI/EMI，I2C，McBSP，SCI，SPI，UART/USART，USB | ||
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Renesas Electronics America |
481
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 144LFQFP
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Tray | H8 H8SX/1600 | -20°C ~ 75°C (TA) | 144-LQFP | 144-LFQFP (20x20) | DMA，LVD，POR，PWM，WDT | H8SX | 92 | 50MHz | 56K x 8 | 1MB (1M x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x10b; D/A 2x8b | EBI/EMI，I2C，IrDA，SCI，SmartCard，USB | ||
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Infineon Technologies |
135
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 144LQFP
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Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 119 | 144MHz | 352K x 8 | 2MB (2M x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | ||
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Texas Instruments |
568
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 176HQFP
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Tray | Automotive，AEC-Q100，C2000 C28x Piccolo | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA，POR，PWM，WDT | C28x | 97 | 120MHz | 50K x 16 | 512KB (256K x 16) | Flash | - | 1.14 V ~ 3.47 V | A/D 17x12b，D/A 3x12b | CANbus，EBI/EMI，I2C，McBSP，SCI，SPI，UART/USART，USB | ||
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Renesas Electronics America |
368
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 176LQFP
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Tray | SuperH SH7216 | -40°C ~ 85°C (TA) | 176-LQFP | - | DMA，PWM，WDT | SH2A-FPU | 112 | 200MHz | 128K x 8 | 1MB (1M x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | CANbus，Ethernet，I2C，SCI，SPI，USB | ||
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NXP USA Inc. |
6,889
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
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Tray | MCF51JM | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，PWM，WDT | Coldfire V1 | 51 | 50MHz | 16K x 8 | 128KB (128K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 12x12b | CANbus，I2C，SCI，SPI，USB OTG | ||
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NXP USA Inc. |
1,604
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，PWM，WDT | Coldfire V1 | 54 | 50MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 20x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
1,898
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 80LQFP
|
Tray | MCF51JM | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (14x14) | LVD，PWM，WDT | Coldfire V1 | 66 | 50MHz | 16K x 8 | 128KB (128K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 12x12b | CANbus，I2C，SCI，SPI，USB OTG | ||
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NXP USA Inc. |
2,050
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 80LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | LVD，PWM，WDT | Coldfire V1 | 69 | 50MHz | 32K x 8 | 256KB (256K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 24x12b | CANbus，I2C，SCI，SPI | ||
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|
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Infineon Technologies |
340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 100-LQFP Exposed Pad | PG-LQFP-100-25 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 73 | 144MHz | 128K x 8 | 256KB (256K x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 16x12b，D/A 2x12b | CANbus，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | ||
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|
|
Infineon Technologies |
1,005
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 100LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 100-LQFP Exposed Pad | PG-LQFP-100-25 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 75 | 144MHz | 352K x 8 | 2MB (2M x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 24x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | ||
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|
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NXP USA Inc. |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 144MAPBGA
|
Tray | MCF520x | -40°C ~ 85°C (TA) | 144-LBGA | 144-MAPBGA (13x13) | DMA，WDT | Coldfire V2 | 30 | 166.67MHz | 16K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，I2C，SPI，UART/USART | ||
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|
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Infineon Technologies |
386
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 119 | 144MHz | 352K x 8 | 2MB (2M x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | ||
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|
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Renesas Electronics America |
278
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 100LQFP
|
Tray | RX600 | -20°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | RX | 117 | 100MHz | 128K x 8 | 2MB (2M x 8) | Flash | - | 3 V ~ 3.6 V | A/D 16x10b; D/A 2x10b | EBI/EMI，I2C，SCI | ||
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Renesas Electronics America |
203
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 120LQFP
|
Tray | H8 H8SX/1600 | -20°C ~ 75°C (TA) | 120-LQFP | 120-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | H8SX | 75 | 50MHz | 40K x 8 | 512KB (512K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x10b; D/A 2x8b | EBI/EMI，I2C，IrDA，SCI，SmartCard，USB | ||
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NXP USA Inc. |
1,794
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 196MAPBGA
|
Tray | MCF520x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，WDT | Coldfire V2 | 50 | 166.67MHz | 16K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，UART/USART |
