- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
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Discover 26 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | ||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE 3M FLASH 384 RAM
|
Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 3
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 3
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU DUAL CORE 3MB FLA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU DUAL CORE 3MB FLA
|
Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 3
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE,3M FLASH
|
Tray | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 120MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH 384 RAM
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 160MHz | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 160MHz |