- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- RAM Size：
-
- Program Memory Size：
-
Discover 35 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
|
|
|
NXP USA Inc. |
622
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 324TEBGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 324TEBGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 80MHz | 64K x 8 | 1MB (1M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 208BGA
|
Tray | -40°C ~ 105°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z1 | 144 | 80MHz | 80K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5KB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5KB (1.5K x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 82MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 80MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 112MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | CANbus，EBI/EMI，Ethernet，SCI，SPI |
