- Packaging:
-
- Operating Temperature:
-
- Core Processor:
-
- RAM Size:
-
- Program Memory Size:
-
- Connectivity:
-
- Core Size:
-
Discover 16 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | RAM Size | Program Memory Size | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | RAM Size | Program Memory Size | Connectivity | Core Size | ||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 80K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z1 | 64K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | e200z0,e200z1 | 80K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | e200z0,e200z1 | 32K x 8 | 512KB (512K x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 32K x 8 | 512KB (512K x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 64K x 8 | 1MB (1M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 64K x 8 | 1MB (1M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | e200z0,e200z1 | 80K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | e200z0,e200z1 | 80K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 180 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 64K x 8 | 512KB (512K x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z1 | 48K x 8 | 768KB (768K x 8) | CANbus,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z1 | 64K x 8 | 1MB (1M x 8) | CANbus,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | e200z0,e200z1 | 64K x 8 | 1MB (1M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 32K x 8 | 512KB (512K x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | e200z0,e200z1 | 64K x 8 | 1MB (1M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | e200z0,e200z1 | 80K x 8 | 1.5MB (1.5M x 8) | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core |