- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Program Memory Size:
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- Voltage - Supply (Vcc/Vdd):
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- Oscillator Type:
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- Connectivity:
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- Core Size:
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Discover 63 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
622
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z1 | 111 | 66MHz | 64K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | e200z0,e200z1 | 137 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 132MHz | 128K x 8 | 3MB (3M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | e200z6 | 256 | 144MHz | 128K x 8 | 3MB (3M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 32K x 8 | 512KB (512K x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 32K x 8 | 512KB (512K x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 324TEBGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 192 | 80MHz | 64K x 8 | 1MB (1M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 64K x 8 | 1MB (1M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 64K x 8 | 1MB (1M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 324TEBGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 80MHz | 64K x 8 | 1MB (1M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | e200z0,e200z1 | 111 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 208BGA
|
Tray | -40°C ~ 105°C (TA) | 208-BGA | 208-MAPBGA (17x17) | e200z1 | 144 | 80MHz | 80K x 8 | 1.5MB (1.5M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | e200z1 | 137 | 66MHz | 64K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | e200z0,e200z1 | 137 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | 4.5 V ~ 5.25 V | Internal | CANbus,EBI/EMI,I2C,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | e200z6 | 220 | 132MHz | 64K x 8 | 1.5MB (1.5M x 8) | 1.35 V ~ 1.65 V | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | 32-Bit |