- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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Discover 20 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Connectivity | ||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1200 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tape & Reel (TR) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Cut Tape (CT) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
- | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1200 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tape & Reel (TR) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Cut Tape (CT) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
- | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
720
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tube | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tray | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
720
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tube | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tray | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
720
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tube | Automotive,AEC-Q100,dsPIC 33CK | -40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tray | Automotive,AEC-Q100,dsPIC 33CK | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tube | Automotive,AEC-Q100,dsPIC 33CK | -40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tray | Automotive,AEC-Q100,dsPIC 33CK | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tape & Reel (TR) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Cut Tape (CT) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
- | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Tape & Reel (TR) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
Cut Tape (CT) | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,64KB FLASH,8KB RAM,
|
- | dsPIC 33CK | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | CANbus,I2C,IrDA,LINbus,SPI,UART/USART |