- Packaging:
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- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Peripherals:
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- RAM Size:
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- Program Memory Size:
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- Voltage - Supply (Vcc/Vdd):
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- Oscillator Type:
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- Selected conditions:
Discover 16 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | ||
NXP USA Inc. |
727
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 516BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
194
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 416BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
48
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 516FBGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
4M FLASH 256K RAM Z7 264MHZ
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 516BGA
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | External | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | PX | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM,WDT | 198 | 192K x 8 | 3MB (3M x 8) | 3 V ~ 5.5 V | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 416BGA
|
Tray | PX | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM,WDT | 198 | 256K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI,UART/USART |