- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- RAM Size：
-
- Program Memory Size：
-
Discover 78 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|
Microchip Technology |
180
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 28SDIP
|
Tube | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SPDIP | 22 | 8K x 8 | 64KB (64K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,337
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | 16 | 4K x 8 | 16KB (16K x 8) | A/D 11x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,246
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-UFQFN Exposed Pad | 28-UQFN (4x4) | 22 | 4K x 8 | 16KB (16K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,222
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 22 | 4K x 8 | 16KB (16K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 490 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 36-VFQFN Exposed Pad | 36-SQFN (6x6) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 14x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Cut Tape (CT) | -40°C ~ 125°C (TA) | 36-VFQFN Exposed Pad | 36-SQFN (6x6) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 14x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
- | -40°C ~ 125°C (TA) | 36-VFQFN Exposed Pad | 36-SQFN (6x6) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 14x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,242
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 22 | 4K x 8 | 16KB (16K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-VQFN Exposed Pad | 28-QFN (6x6) | 22 | 4K x 8 | 16KB (16K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,865
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 20QFN
|
Tube | -40°C ~ 85°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (4x4) | 16 | 8K x 8 | 64KB (64K x 8) | A/D 11x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,274
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (4x4) | 16 | 8K x 8 | 32KB (32K x 8) | A/D 11x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,274
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-UFQFN Exposed Pad | 28-UQFN (4x4) | 22 | 8K x 8 | 32KB (32K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,222
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 22 | 8K x 8 | 32KB (32K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,134
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 22 | 8K x 8 | 32KB (32K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | 16 | 8K x 8 | 64KB (64K x 8) | A/D 11x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16KB FLASH，4KB RAM，79 COREMARK
|
Tray | -40°C ~ 125°C (TA) | 40-UFQFN Exposed Pad | 40-UQFN (5x5) | 29 | 4K x 8 | 16KB (16K x 8) | A/D 14x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,092
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (4x4) | 16 | 8K x 8 | 64KB (64K x 8) | A/D 11x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,047
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-UFQFN Exposed Pad | 28-UQFN (4x4) | 22 | 8K x 8 | 64KB (64K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,034
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 22 | 8K x 8 | 64KB (64K x 8) | A/D 12x10/12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,098
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，8KB RAM，79 COREMARK
|
Tube | -40°C ~ 125°C (TA) | 28-VQFN Exposed Pad | 28-QFN (6x6) | 22 | 8K x 8 | 64KB (64K x 8) | A/D 12x10/12b，D/A 1x5b |
