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Discover 36 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
Inquiry
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MOQ: 880 MPQ: 1
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SINGLE CORE 3M FLASH 384 RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 160MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 880 MPQ: 1
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SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 160MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 1000 MPQ: 1
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NXP 32-BIT MCU DUAL CORE 3MB FLA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | e200z4 | 178 | 160MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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NXP 32-BIT MCU DUAL CORE 3MB FLA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | e200z4 | 178 | 160MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 3
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 160MHz | 3MB (3M x 8) | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 1.5MB (1.5M x 8) | 1.14 V ~ 5.5 V | A/D 22x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
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MOQ: 750 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 473BGA
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Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 1.5MB (1.5M x 8) | 1.14 V ~ 5.5 V | A/D 34x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 1.5MB (1.5M x 8) | 1.14 V ~ 5.5 V | A/D 34x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 152 MPQ: 1
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NXP 32-BIT MCU DUAL POWER ARCH
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Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 1.5MB (1.5M x 8) | 1.14 V ~ 5.5 V | A/D 22x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 473BGA
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Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 1.5MB (1.5M x 8) | 1.14 V ~ 5.5 V | A/D 34x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core |
