- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Peripherals：
-
- Program Memory Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Selected conditions:
Discover 40 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|
|
|
NXP USA Inc. |
299
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，POR，WDT | 39 | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 4x10b | CANbus，Ethernet，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | 77 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 7x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，PWM，WDT | 149 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 29x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | 121 | 1.5MB (1.5M x 8) | 3 V ~ 5.5 V | A/D 15x10b，5x12b | CANbus，I2C，LINbus，SCI，SPI |
