- Packaging:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Speed:
-
- RAM Size:
-
- Program Memory Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Core Size:
-
- Selected conditions:
Discover 6 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 48LQFP
|
Tray | LPC11Axx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 4K x 8 | 16KB (16K x 8) | 2.6 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | I2C,Microwire,SPI,SSI,SSP,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 32MHz | 4K x 8 | 64KB (64K x 8) | 3.5 V ~ 40 V | A/D 16x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 32MHz | 4K x 8 | 64KB (64K x 8) | 3.5 V ~ 40 V | A/D 16x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tray | Automotive,AEC-Q100,S12 MagniV | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 32MHz | 4K x 8 | 64KB (64K x 8) | 3.5 V ~ 40 V | A/D 16x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 23 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 52PLCC
|
Tube | HC08 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | LVD,POR,PWM | HC08 | 8.4MHz | 2K x 8 | 60KB (60K x 8) | 4.5 V ~ 5.5 V | A/D 15x8b | CANbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 299 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 52PLCC
|
Tube | HC08 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | LVD,POR,PWM | HC08 | 8.4MHz | 2K x 8 | 60KB (60K x 8) | 4.5 V ~ 5.5 V | A/D 15x8b | CANbus,SCI,SPI | 8-Bit |