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- Operating Temperature：
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- Supplier Device Package：
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- RAM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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Discover 166 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
|
Microchip Technology |
376
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 28SOIC
|
Tube | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 25 | 4K x 8 | 64KB (32K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
275
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 28SDIP
|
Tube | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SDIP | 25 | 4K x 8 | 64KB (32K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
302
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Tray | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | 36 | 4K x 8 | 64KB (32K x 16) | 2.3 V ~ 5.5 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
369
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 28SSOP
|
Tube | PIC XLP 18K | -40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 25 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
293
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 28SDIP
|
Tube | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SPDIP | 25 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
479
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 44TQFP
|
Tray | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | 36 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
498
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 48TQFP
|
Tray | PIC XLP 18K | -40°C ~ 85°C (TA) | 48-TQFP Exposed Pad | 48-TQFP-EP (7x7) | 44 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 43x12b，D/A 1x5b | |||
|
|
Microchip Technology |
692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 44TQFP
|
Tray | PIC XLP 18K | -40°C ~ 125°C (TA) | 44-TQFP | 44-TQFP (10x10) | 36 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
227
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 40DIP
|
Tube | PIC XLP 18F | -40°C ~ 85°C (TA) | 40-DIP (0.600"，15.24mm) | 40-PDIP | 36 | 8K x 8 | 128KB (64K x 16) | 2.3 V ~ 5.5 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM,
|
Tape & Reel (TR) | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 25 | 4K x 8 | 64KB (64K x 8) | 1.8 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM,
|
Cut Tape (CT) | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 25 | 4K x 8 | 64KB (32K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM,
|
- | PIC XLP 18K | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 25 | 4K x 8 | 64KB (32K x 16) | 2.3 V ~ 5.5 V | A/D 24x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Tape & Reel (TR) | PIC XLP 18K | -40°C ~ 85°C (TA) | 40-UFQFN Exposed Pad | 40-UQFN (5x5) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Cut Tape (CT) | PIC XLP 18K | -40°C ~ 85°C (TA) | 40-UFQFN Exposed Pad | 40-UQFN (5x5) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
- | PIC XLP 18K | -40°C ~ 85°C (TA) | 40-UFQFN Exposed Pad | 40-UQFN (5x5) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1600 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Tape & Reel (TR) | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-VQFN Exposed Pad | 44-QFN (8x8) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Cut Tape (CT) | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-VQFN Exposed Pad | 44-QFN (8x8) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
- | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-VQFN Exposed Pad | 44-QFN (8x8) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1200 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Tape & Reel (TR) | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b | |||
|
|
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64KB FLASH，4KB RAM，1KB EEPROM
|
Cut Tape (CT) | PIC XLP 18K | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | 36 | 4K x 8 | 64KB (32K x 16) | 1.8 V ~ 3.6 V | A/D 35x12b，D/A 1x5b |
