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- Peripherals:
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- Core Processor:
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Discover 90 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
1,060
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
1,090
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
374
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
2,156
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
2,129
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 91 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
289
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
470
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 91 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 26 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 26 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
62
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | PWM,WDT | HCS12 | 59 | 25MHz | 4K x 8 | 32KB (32K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 91 | 25MHz | 4K x 8 | 64KB (64K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 26 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | 48-QFN-EP (7x7) | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | LVD,POR,PWM,WDT | 12V1 | 14 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | 12V1 | 26 | 25MHz | 2K x 8 | 32KB (32K x 8) | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA,LINbus,SCI,SPI |