- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Data Converters:
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Discover 80 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Data Converters | Connectivity | ||
Microchip Technology |
2,100
|
3 days |
-
|
MOQ: 2100 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
2,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
2,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
- | -40°C ~ 85°C (TA) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
- | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
- | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
- | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
- | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
- | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1600 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART |