- Operating Temperature:
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- Supplier Device Package:
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- RAM Size:
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- Program Memory Size:
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Discover 80 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
Microchip Technology |
579
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tray | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
530
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tray | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tray | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tray | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
543
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tray | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tray | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tray | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART |