- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- RAM Size：
-
- Program Memory Size：
-
- Data Converters：
-
- Selected conditions:
Discover 48 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|
|
|
Microchip Technology |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
-40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
-40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
-40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
-40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
-40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
-40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
-40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
-40°C ~ 125°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
Microchip Technology |
705
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
705
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
-40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
705
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
-40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
-40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
802
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
-40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
705
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
-40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
976
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
-40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART |
