- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Speed：
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- Data Converters：
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Discover 54 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | RAM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | RAM Size | Data Converters | Connectivity | |
|
Microchip Technology |
287
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28SOIC
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 44TQFP
|
Tray | Automotive，AEC-Q100，dsPIC 33EV | -40°C ~ 125°C (TA) | 44-TQFP | 44-TQFP (10x10) | 35 | 60 MIPs | 4K x 8 | A/D 24x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Cut Tape (CT) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
- | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
306
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28QFN
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-VQFN Exposed Pad | 28-QFN-S (6x6) | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
730
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
286
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28SDIP
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SPDIP | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
816
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28QFN
|
Tube | Automotive，AEC-Q100，dsPIC 33EV | -40°C ~ 125°C (TA) | 28-VQFN Exposed Pad | 28-QFN-S (6x6) | 21 | 60 MIPs | 4K x 8 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
584
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tube | Automotive，AEC-Q100，dsPIC 33EV | -40°C ~ 125°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 60 MIPs | 4K x 16 | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
584
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28SSOP
|
Tube | Automotive，AEC-Q100，dsPIC 33EV | -40°C ~ 125°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 60 MIPs | 4K x 8 | A/D 11x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
584
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tube | Automotive，AEC-Q100，dsPIC 33EV | -40°C ~ 125°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 60 MIPs | 4K x 16 | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
ECC FLASH，4KB RAM
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,284
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
Cut Tape (CT) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,284
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，4KB RAM
|
- | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 25 | 70 MIPs | 4K x 16 | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
43
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 44QFN
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 44-VQFN Exposed Pad | 44-QFN (8x8) | 35 | 70 MIPs | 2K x 16 | A/D 24x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 329 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28SSOP
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1600 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28SOIC
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1600 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 28QFN
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-VQFN Exposed Pad | 28-QFN-S (6x6) | 21 | 70 MIPs | 2K x 16 | A/D 11x10/12b | I2C，IrDA，LINbus，SPI，UART/USART |
