Series:
Operating Temperature:
Package / Case:
Supplier Device Package:
Core Processor:
Speed:
Program Memory Type:
Voltage - Supply (Vcc/Vdd):
Data Converters:
Oscillator Type:
Connectivity:
Core Size:
Discover 5 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed RAM Size Program Memory Type Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Connectivity Core Size
MC9S08LC36LK
NXP USA Inc.
480
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 36KB FLASH 80LQFP
S08 0°C ~ 70°C (TA) 80-LQFP 80-FQFP (12x12) LCD,LVD,POR,PWM,WDT S08 40MHz 2.5K x 8 Flash 1.8 V ~ 3.6 V A/D 8x12b External I2C,SCI,SPI 8-Bit
MAXQ61HX-2028+
Maxim Integrated
Inquiry
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-
MOQ: 0  MPQ: 1
MODULE MCU 16BIT
MAXQ 0°C ~ 70°C Die Die Brown-out Detect/Reset,Infrared,Power-Fail,POR,WDT MAXQ 12MHz 1.28K x 8 ROM 1.7 V ~ 3.6 V - - - 16-Bit
MAXQ61HX-2561+
Maxim Integrated
Inquiry
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-
MOQ: 0  MPQ: 1
MODULE MCU 16BIT
MAXQ 0°C ~ 70°C Die Die Brown-out Detect/Reset,Infrared,Power-Fail,POR,WDT MAXQ 12MHz 1.28K x 8 ROM 1.7 V ~ 3.6 V - - - 16-Bit
MAXQ61HX-2564+
Maxim Integrated
Inquiry
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-
MOQ: 0  MPQ: 1
MODULE MCU 16BIT
MAXQ 0°C ~ 70°C Die Die Brown-out Detect/Reset,Infrared,Power-Fail,POR,WDT MAXQ 12MHz 1.28K x 8 ROM 1.7 V ~ 3.6 V - - - 16-Bit
MAXQ61HX-2565+
Maxim Integrated
Inquiry
-
-
MOQ: 0  MPQ: 1
MODULE MCU 16BIT
MAXQ 0°C ~ 70°C Die Die Brown-out Detect/Reset,Infrared,Power-Fail,POR,WDT MAXQ 12MHz 1.28K x 8 ROM 1.7 V ~ 3.6 V - - - 16-Bit