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- Supplier Device Package:
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- Core Processor:
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Discover 21 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
17
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 169MAPBGA
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Tray | Kinetis K27F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA,I2S,PWM,WDT | ARM Cortex-M4 | 120 | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR,D/A 2x6b,1x12b | Internal/External | EBI/EMI,I2C,QSPI,SDHC,SPI,UART/USART,USB | 32-Bit | ||||
STMicroelectronics |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tape & Reel (TR) | SPC56 | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA,POR,PWM,WDT | e200z4 | 150 | 128K x 8 | 1.14 V ~ 1.32 V | A/D 34x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
STMicroelectronics |
Inquiry
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- |
-
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MOQ: 400 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tray | Automotive,AEC-Q100,SPC56 | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA,POR,PWM,WDT | e200z4 | 150 | 128K x 8 | 1.14 V ~ 1.32 V | A/D 34x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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2MB NVM 2 X E200Z4 CORES 150MH
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA,LVD,POR,WDT | e200z4 | - | 256K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | CANbus,Ethernet,FlexRay, LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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2MB NVM 2 X E200Z4 CORES 150MH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA,LVD,POR,WDT | e200z4 | - | 256K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | CANbus,Ethernet,FlexRay, LINbus,SPI,UART/USART | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA,POR,PWM,WDT | e200z4 | 84 | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA,POR,PWM,WDT | e200z4 | 84 | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA,POR,PWM,WDT | e200z4 | 151 | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 240 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | TC17xx | -40°C ~ 85°C (TA) | 416-BBGA | PG-BGA-416-4 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
Infineon Technologies |
Inquiry
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- |
-
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MOQ: 240 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | TC17xx | -40°C ~ 125°C (TA) | 416-BBGA | PG-BGA-416-4 | DMA,POR,WDT | TriCore | 123 | 256K x 8 | 1.42 V ~ 1.58 V | A/D 44x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
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IC MCU 32BIT 2MB FLASH 169MAPBGA
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Tray | Kinetis K28F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA,I2S,PWM,WDT | ARM Cortex-M4 | 120 | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR,D/A 2x6b,1x12b | Internal/External | EBI/EMI,I2C,QSPI,SDHC,SPI,UART/USART,USB | 32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 350 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324BGA
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Tape & Reel (TR) | SPC56 | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA,POR,PWM,WDT | e200z4 | 190 | 128K x 8 | 1.14 V ~ 1.32 V | A/D 40x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 360 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324BGA
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Tray | SPC56 | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA,POR,PWM,WDT | e200z4 | 190 | 128K x 8 | 1.14 V ~ 1.32 V | A/D 40x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 3000 MPQ: 1
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150MHZ ARM CORTEX-M4F
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Tape & Reel (TR) | Kinetis K27F | -40°C ~ 85°C (TA) | 210-UFBGA,WLCSP | 210-WLCSP (6.93x6.93) | DMA,I2S,PWM,WDT | ARM Cortex-M4 | 120 | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR,D/A 2x6b,1x12b | Internal/External | EBI/EMI,I2C,QSPI,SDHC,SPI,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
|
150MHZ ARM CORTEX 1.3
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Tray | Kinetis K27F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA,I2S,PWM,WDT | ARM Cortex-M4 | 120 | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR,D/A 2x6b,1x12b | Internal/External | EBI/EMI,I2C,QSPI,SDHC,SPI,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 3000 MPQ: 1
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IC MCU 32BIT 2MB FLASH 210WLCSP
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Tape & Reel (TR) | Kinetis K28F | -40°C ~ 85°C (TA) | 210-UFBGA,WLCSP | 210-WLCSP (6.93x6.93) | DMA,I2S,PWM,WDT | ARM Cortex-M4 | 120 | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR,D/A 2x6b,1x12b | Internal/External | EBI/EMI,I2C,QSPI,SDHC,SPI,UART/USART,USB | 32-Bit |