- Packaging:
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- Operating Temperature:
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- Supplier Device Package:
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- Core Processor:
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- RAM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Selected conditions:
Discover 32 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
Microchip Technology |
676
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FLASH,384KB SRAM
|
Tray | Automotive,AEC-Q100,SAM V71 | -40°C ~ 105°C (TA) | 144-TFBGA (10x10) | ARM Cortex-M7 | 114 | 300MHz | 384K x 8 | 3 V ~ 3.6 V | A/D 24x12b,D/A 2x12b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,LINbus,MMC/SD/SDIO,QSPI,SPI,SSC,UART/USART,USB | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 2200 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
Tape & Reel (TR) | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
Cut Tape (CT) | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
- | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 2200 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
Tape & Reel (TR) | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
Cut Tape (CT) | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
- | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 2200 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
Tape & Reel (TR) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
Cut Tape (CT) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,NO CRYP
|
- | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 2200 MPQ: 1
|
32 BIT MCU,FPU,2MB FLASH,512K
|
Tape & Reel (TR) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32 BIT MCU,FPU,2MB FLASH,512K
|
Cut Tape (CT) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32 BIT MCU,FPU,2MB FLASH,512K
|
- | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 2200 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
Tape & Reel (TR) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
Cut Tape (CT) | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
2,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2048KB FLASH,512KB RAM,CRYPTO,
|
- | Automotive,AEC-Q100,PIC 32MZ | -40°C ~ 125°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 180MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FLASH,512KB RAM
|
Tray | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FLASH,512KB RAM
|
Tray | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FLASH,512KB RAM
|
Tray | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 200MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG | ||||
Microchip Technology |
510
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FLASH,512KB RAM
|
Tray | PIC 32MZ | -40°C ~ 85°C (TA) | 144-TFBGA (7x7) | MIPS32 M-Class | 120 | 252MHz | 512K x 8 | 2.1 V ~ 3.6 V | A/D 48x12b | CANbus,EBI/EMI,Ethernet,I2C,PMP,SPI,SQI,UART/USART,USB OTG |