- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Speed：
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- EEPROM Size：
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- Data Converters：
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- Connectivity：
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Discover 38 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | EEPROM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | EEPROM Size | Data Converters | Connectivity | |
|
|
|
NXP USA Inc. |
1,280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 32MHz | 2K x 8 | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 32MHz | 2K x 8 | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 32MHz | 2K x 8 | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 32MHz | 2K x 8 | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 42 | 32MHz | 2K x 8 | A/D 16x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 42 | 32MHz | 2K x 8 | A/D 16x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 42 | 32MHz | 2K x 8 | A/D 16x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 42 | 32MHz | 2K x 8 | A/D 16x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
S12Z CORE128K FLASHCAN
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64LQFP
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | 31 | 50MHz | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI |
