- Manufacturer：
-
- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Peripherals：
-
- Core Processor：
-
- RAM Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Oscillator Type：
-
- Connectivity：
-
- Core Size：
-
- Selected conditions:
Discover 63 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|
|
|
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
Tape & Reel (TR) | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
Cut Tape (CT) | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
- | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
4,952
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16SOP
|
Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 6x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
3,735
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
4,197
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,544
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | LVD，POR，PWM | S08 | 14 | 512 x 8 | 2.7 V ~ 5.5 V | - | Internal | LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
796
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-LQFP | 44-LQFP (10x10) | LVD，POR，PWM，WDT | S08 | 33 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
497
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 6x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
437
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 20SOIC
|
Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | LVD，PWM，WDT | ARM Cortex-M0+ | 18 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 10x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
771
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-UFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
575
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
|
Tube | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
880
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 12x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
211
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 12x12b，D/A 1x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
52
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 32LQFP
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 14x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
196
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 32QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 14x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | LVD，POR，PWM | S08 | 14 | 512 x 8 | 2.7 V ~ 5.5 V | - | Internal | LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
144
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 32LQFP
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 14x12b，D/A 1x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 32QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 1K x 8 | 1.71 V ~ 3.6 V | A/D 14x12b，D/A 1x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
184
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
|
Tube | Kinetis KEA | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit |
