- Operating Temperature：
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- Supplier Device Package：
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Discover 96 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
1,566
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 28SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | S08 | 24 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI | ||
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NXP USA Inc. |
2,040
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 32LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | HC08 | 21 | 8MHz | 1K x 8 | - | 3 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16SOIC
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Tape & Reel (TR) | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | HC08 | 13 | 8MHz | 256 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | SCI，SPI | ||
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NXP USA Inc. |
1,999
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16SOIC
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Cut Tape (CT) | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | HC08 | 13 | 8MHz | 256 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | SCI，SPI | ||
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NXP USA Inc. |
1,999
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16SOIC
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- | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | HC08 | 13 | 8MHz | 256 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | SCI，SPI | ||
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NXP USA Inc. |
1,386
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI | ||
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NXP USA Inc. |
573
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16SOIC
|
Tube | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | HC08 | 13 | 8MHz | 256 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | SCI，SPI | ||
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NXP USA Inc. |
220
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16SOIC
|
Tube | HC08 | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | HC08 | 13 | 8MHz | 192 x 8 | - | 2.7 V ~ 5.5 V | A/D 4x8b | Internal | SCI | ||
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NXP USA Inc. |
2,544
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | S08 | 14 | 48MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | - | Internal | LINbus，SCI，SPI，USB | ||
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NXP USA Inc. |
1,303
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 20SOIC
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Tube | HC08 | 0°C ~ 70°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | HC08 | 13 | 3MHz | 256 x 8 | - | 4 V ~ 5.5 V | - | Internal | USB | ||
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NXP USA Inc. |
824
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 44QFP
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Tray | HC08 | 0°C ~ 70°C (TA) | 44-QFP | 44-QFP (10x10) | HC08 | 37 | 3MHz | 256 x 8 | - | 4 V ~ 5.5 V | - | Internal | USB | ||
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NXP USA Inc. |
616
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 48LQFP
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Tray | HC08 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | HC08 | 37 | 8MHz | 1K x 8 | - | 3 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
261
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 24QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | - | Internal | LINbus，SCI，SPI，USB | ||
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NXP USA Inc. |
480
|
3 days |
-
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MOQ: 1 MPQ: 1
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MCU 8-BIT 8KB 20MHZ TSSOP16
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- | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 6x10b | Internal | LINbus，SCI，UART/USART | ||
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NXP USA Inc. |
375
|
3 days |
-
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MOQ: 1 MPQ: 1
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MCU 8-BIT 8KB 20MHZ TSSOP20
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- | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | S08 | 18 | 20MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI，UART/USART | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2500 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 24QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | - | Internal | LINbus，SCI，SPI，USB | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 26 MPQ: 1
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IC MCU 8BIT 8KB FLASH 28SOIC
|
Tube | S08 | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | S08 | 24 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | S08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 512 x 8 | - | 2.7 V ~ 5.5 V | A/D 10x10b | Internal | LINbus，SCI |
