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- Supplier Device Package：
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- Core Processor：
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- Speed：
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- Program Memory Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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Discover 194 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Microchip Technology |
232
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 28QFN
|
Tube | dsPIC 33EP | -40°C ~ 85°C (TA) | 28-VQFN Exposed Pad | 28-QFN-S (6x6) | dsPIC | 21 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 6x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
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Microchip Technology |
1,713
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64TQFP
|
Tray | dsPIC 33EP | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | dsPIC | 53 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 16x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 28SOIC
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | dsPIC | 21 | 70 MIPs | 256KB (85.5K x 24) | 4.5 V ~ 5.5 V | A/D 11x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
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Microchip Technology |
314
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 28SDIP
|
Tube | dsPIC 33EV | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SPDIP | dsPIC | 21 | 70 MIPs | 256KB (85.5K x 24) | 4.5 V ~ 5.5 V | A/D 11x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,635
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 44TQFP
|
Tray | dsPIC 33EV | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | dsPIC | 35 | 70 MIPs | 256KB (85.5K x 24) | 4.5 V ~ 5.5 V | A/D 24x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
281
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 64TQFP
|
Tray | dsPIC 33EV | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | dsPIC | 53 | 70 MIPs | 256KB (85.5K x 24) | 4.5 V ~ 5.5 V | A/D 36x10/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
238
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 28SDIP
|
Tube | dsPIC 33EP | -40°C ~ 85°C (TA) | 28-DIP (0.300"，7.62mm) | 28-SPDIP | dsPIC | 21 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 6x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
213
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 44TQFP
|
Tray | dsPIC 33EP | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | dsPIC | 35 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 9x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
333
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 44QFN
|
Tube | dsPIC 33EP | -40°C ~ 85°C (TA) | 44-VQFN Exposed Pad | 44-QFN (8x8) | dsPIC | 35 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 9x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
241
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64TQFP
|
Tray | PIC 24EP | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | PIC | 53 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 16x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
194
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 44TQFP
|
Tray | dsPIC 33EP | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | dsPIC | 35 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 9x10b/12b | CANbus，I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
407
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 64TQFP
|
Tray | dsPIC 33EP | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | dsPIC | 53 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 16x10b/12b | CANbus，I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
ECC FLASH，8KB RAM
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 128KB (43K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，8KB RAM
|
Cut Tape (CT) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 128KB (43K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，8KB RAM
|
- | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 128KB (43K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
367
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 28SSOP
|
Tube | dsPIC 33EP | -40°C ~ 85°C (TA) | 28-SSOP (0.209"，5.30mm Width) | 28-SSOP | dsPIC | 21 | 70 MIPs | 128KB (43K x 24) | 3 V ~ 3.6 V | A/D 6x10b/12b | I2C，IrDA，LINbus，QEI，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
ECC FLASH，8KB RAM
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 64KB (22K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，8KB RAM
|
Cut Tape (CT) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 64KB (22K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ECC FLASH，8KB RAM
|
- | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 64KB (22K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
ECC FLASH，8KB RAM
|
Tape & Reel (TR) | dsPIC 33EV | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | dsPIC | 25 | 70 MIPs | 128KB (43K x 24) | 4.5 V ~ 5.5 V | A/D 13x10b/12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART |
