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Discover 7 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
1,571
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 100LQFP
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Tray | LPC2300 | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM7 | 70 | 72MHz | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 6x10b; D/A 1x10b | CANbus，Ethernet，I2C，Microwire，Memory Card，SPI，SSI，SSP，UART/USART，USB OTG | ||
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NXP USA Inc. |
1,427
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 144LQFP
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Tray | LPC2300 | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM7 | 104 | 72MHz | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus，EBI/EMI，Ethernet，I2C，Microwire，Memory Card，SPI，SSI，SSP，UART/USART，USB OTG | ||
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NXP USA Inc. |
240
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 208BGA
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Tray | LPC2400 | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (15x15) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM7 | 160 | 72MHz | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus，EBI/EMI，Ethernet，I2C，Microwire，Memory Card，SPI，SSI，SSP，UART/USART，USB OTG | ||
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NXP USA Inc. |
587
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 208LQFP
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Tray | LPC2400 | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP (28x28) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM7 | 160 | 72MHz | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus，EBI/EMI，Ethernet，I2C，Microwire，Memory Card，SPI，SSI，SSP，UART/USART，USB OTG | ||
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NXP USA Inc. |
229
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 180BGA
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Tray | LPC2400 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM7 | 136 | 72MHz | 512KB (512K x 8) | 3 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus，EBI/EMI，Ethernet，I2C，Microwire，Memory Card，SPI，SSI，SSP，UART/USART，USB OTG | ||
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Infineon Technologies |
Inquiry
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-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 1.06MB FLSH 100LQFP
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- | XC23xxE | -40°C ~ 125°C (TA) | - | - | I2S，POR，PWM，WDT | C166SV2 | 75 | 128MHz | 1.06MB (1.06M x 8) | 3 V ~ 5.5 V | A/D 16x10b | CANbus，EBI/EMI，I2C，LINbus，SPI，SSC，UART/USART，USI | ||
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Infineon Technologies |
Inquiry
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 1.06MB FLASH 100QFP
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- | XC23xxE | -40°C ~ 125°C (TA) | - | - | I2S，POR，PWM，WDT | C166SV2 | 75 | 128MHz | 1.06MB (1.06M x 8) | 3 V ~ 5.5 V | A/D 16x10b | CANbus，EBI/EMI，I2C，LINbus，SPI，SSC，UART/USART，USI |
