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Discover 41 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BITDUAL CORE3M FLASH384 RA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 3MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 3M FLASH 512K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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32 BITDUAL CORE3M FLASH512K R
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI | 32-Bit Dual-Core | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
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IC MCU 32BIT 2MB FLASH 180WLCSP
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Tape & Reel (TR) | STM32F7 | -40°C ~ 85°C (TA) | 180-UFBGA，WLCSP | 180-WLCSP (5.5x6) | Brown-out Detect/Reset，DMA，I2S，LCD，POR，PWM，WDT | ARM Cortex-M7 | 216MHz | 2MB (2M x 8) | 1.7 V ~ 3.6 V | A/D 24x12b，A/D 2x12b | CANbus，EBI/EMI，I2C，IrDA，LINbus，MMC/SD/SDIO，QSPI，SAI，SPDIF，SPI，UART/USART，USB OTG | 32-Bit |
