- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Connectivity:
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- Selected conditions:
Discover 15 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | ||
NXP USA Inc. |
3,768
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PA4 SOIC8
|
Tube | -40°C ~ 105°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
2,400
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PA4 TSSOP20
|
Tube | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
2,450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8QFN
|
Tray | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP (4x4) | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
8 BITLOW END CORE4K FL
|
Tray | -40°C ~ 105°C (TA) | 8-VDFN Exposed Pad | 8-DFN (3x3) | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 40MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8QFN
|
Tray | -40°C ~ 125°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP (4x4) | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 98 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | -40°C ~ 125°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 40MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
- | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 98 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | -40°C ~ 125°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 98 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tube | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8SOIC
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 8QFN
|
Tray | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP (4x4) | 20MHz | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | I2C,SCI,SPI |