- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Selected conditions:
Discover 61 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
3,750
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tape & Reel (TR) | HC08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC08 | 33 | 8MHz | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
3,982
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Cut Tape (CT) | HC08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC08 | 33 | 8MHz | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
3,982
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
- | HC08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC08 | 33 | 8MHz | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
1,387
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC08 | 33 | 8MHz | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
1,566
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 28SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | S08 | 24 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
1,386
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
426
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 14 | 48MHz | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
2,544
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 14 | 48MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
4,952
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MCU 8-BIT 4KB 20MHZ SOIC8
|
- | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | S08 | 6 | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | LINbus,SCI,UART/USART | ||||
NXP USA Inc. |
478
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MCU 8-BIT 4KB 20MHZ TSSOP16
|
- | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | LINbus,SCI,UART/USART | ||||
NXP USA Inc. |
375
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MCU 8-BIT 4KB 20MHZ TSSOP20
|
- | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 18 | 20MHz | 4KB (4K x 8) | 128 x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | LINbus,SCI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 26 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 28SOIC
|
Tube | S08 | -40°C ~ 105°C (TA) | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | S08 | 24 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tube | S08 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x10b | LINbus,SCI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 14 | 48MHz | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 38 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 14 | 48MHz | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | - | LINbus,SCI,SPI,USB |