- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- RAM Size:
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- Program Memory Size:
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- Data Converters:
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Discover 14 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | ||
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
- | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
1,482
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
1,334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 33-HVQFN (5x5) | 29 | 4K x 8 | 16KB (16K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 4K x 8 | 16KB (16K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
2,327
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 4K x 8 | 16KB (16K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
2,327
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
- | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 4K x 8 | 16KB (16K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20TSSOP
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 8K x 8 | 32KB (32K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
1,687
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20TSSOP
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 8K x 8 | 32KB (32K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
1,687
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20TSSOP
|
- | LPC82x | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 8K x 8 | 32KB (32K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
439
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+ MICROCONTR
|
Tube | LPC83x | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | 16 | 4K x 8 | 16KB (16K x 8) | A/D 5x12b | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
32-BIT ARM CORTEX-M0+ MICROCONTR
|
Tape & Reel (TR) | LPC83x | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 4K x 8 | 32KB (32K x 8) | A/D 12x12b | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32HVQFN
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 29 | 4K x 8 | 16KB (16K x 8) | A/D 12x12b |