Discover 14 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Number of I/O RAM Size Program Memory Size Data Converters
LPC824M201JHI33Y
NXP USA Inc.
6,000
3 days
-
MOQ: 6000  MPQ: 1
IC MCU 32BIT 32KB FLASH 32HVQFN
Tape & Reel (TR) LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 8K x 8 32KB (32K x 8) A/D 12x12b
LPC824M201JHI33Y
NXP USA Inc.
7,619
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 32HVQFN
Cut Tape (CT) LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 8K x 8 32KB (32K x 8) A/D 12x12b
LPC824M201JHI33Y
NXP USA Inc.
7,619
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 32HVQFN
- LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 8K x 8 32KB (32K x 8) A/D 12x12b
LPC824M201JHI33E
NXP USA Inc.
1,482
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 32HVQFN
Tray LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 8K x 8 32KB (32K x 8) A/D 12x12b
LPC822M101JHI33E
NXP USA Inc.
1,334
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 33-HVQFN (5x5) 29 4K x 8 16KB (16K x 8) A/D 12x12b
LPC822M101JDH20J
NXP USA Inc.
Inquiry
-
-
MOQ: 2500  MPQ: 1
IC MCU 32BIT 16KB FLASH 20TSSOP
Tape & Reel (TR) LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 4K x 8 16KB (16K x 8) A/D 5x12b
LPC822M101JDH20J
NXP USA Inc.
2,327
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 20TSSOP
Cut Tape (CT) LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 4K x 8 16KB (16K x 8) A/D 5x12b
LPC822M101JDH20J
NXP USA Inc.
2,327
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 20TSSOP
- LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 4K x 8 16KB (16K x 8) A/D 5x12b
LPC824M201JDH20J
NXP USA Inc.
Inquiry
-
-
MOQ: 2500  MPQ: 1
IC MCU 32BIT 32KB FLASH 20TSSOP
Tape & Reel (TR) LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 8K x 8 32KB (32K x 8) A/D 5x12b
LPC824M201JDH20J
NXP USA Inc.
1,687
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 20TSSOP
Cut Tape (CT) LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 8K x 8 32KB (32K x 8) A/D 5x12b
LPC824M201JDH20J
NXP USA Inc.
1,687
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 20TSSOP
- LPC82x -40°C ~ 105°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 8K x 8 32KB (32K x 8) A/D 5x12b
LPC832M101FDH20FP
NXP USA Inc.
439
3 days
-
MOQ: 1  MPQ: 1
32-BIT ARM CORTEX-M0+ MICROCONTR
Tube LPC83x -40°C ~ 85°C (TA) 20-TSSOP (0.173",4.40mm Width) 20-TSSOP 16 4K x 8 16KB (16K x 8) A/D 5x12b
LPC834M101FHI33Y
NXP USA Inc.
Inquiry
-
-
MOQ: 6000  MPQ: 1
32-BIT ARM CORTEX-M0+ MICROCONTR
Tape & Reel (TR) LPC83x -40°C ~ 85°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 4K x 8 32KB (32K x 8) A/D 12x12b
LPC822M101JHI33Y
NXP USA Inc.
Inquiry
-
-
MOQ: 6000  MPQ: 1
IC MCU 32BIT 16KB FLASH 32HVQFN
Tape & Reel (TR) LPC82x -40°C ~ 105°C (TA) 32-VFQFN Exposed Pad 32-HVQFN (5x5) 29 4K x 8 16KB (16K x 8) A/D 12x12b