- Manufacturer:
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- Series:
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- Operating Temperature:
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- Supplier Device Package:
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- Peripherals:
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- RAM Size:
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Discover 48 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
12,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,059
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
- | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 125°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 16QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 16QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-QFN-EP (5x5) | LVD,POR,PWM,WDT | S08 | 12 | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
Microchip Technology |
2,334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Tube | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,PWM,WDT | PIC | 11 | 128 x 8 | 3.5KB (2K x 14) | - | 2 V ~ 5.5 V | A/D 8x10b | - | ||||
Microchip Technology |
4,169
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 16QFN
|
Tube | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,WDT | PIC | 12 | 256 x 8 | 7KB (4K x 14) | 256 x 8 | 2 V ~ 5.5 V | A/D 8x10b | UART/USART | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Tape & Reel (TR) | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,LVD,POR,WDT | PIC | 11 | 128 x 8 | 3.5KB (2K x 14) | - | 2 V ~ 5.5 V | - | - | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Cut Tape (CT) | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,LVD,POR,WDT | PIC | 11 | 128 x 8 | 3.5KB (2K x 14) | - | 2 V ~ 5.5 V | - | - | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
- | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,LVD,POR,WDT | PIC | 11 | 128 x 8 | 3.5KB (2K x 14) | - | 2 V ~ 5.5 V | - | - | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Tape & Reel (TR) | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,PWM,WDT | PIC | 12 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | 2 V ~ 5.5 V | A/D 8x10b | - | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Cut Tape (CT) | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,PWM,WDT | PIC | 12 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | 2 V ~ 5.5 V | A/D 8x10b | - | ||||
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
- | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,PWM,WDT | PIC | 12 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | 2 V ~ 5.5 V | A/D 8x10b | - | ||||
Microchip Technology |
5,096
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 16QFN
|
Tube | PIC 16F | -40°C ~ 85°C (TA) | 16-QFN (4x4) | Brown-out Detect/Reset,POR,WDT | PIC | 11 | 128 x 8 | 3.5KB (2K x 14) | - | 2 V ~ 5 V | A/D 8x10b | - |