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Discover 19 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Texas Instruments |
2,900
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 144LQFP
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Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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Texas Instruments |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 64 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 880 MPQ: 1
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SINGLE CORE 3M FLASH 384 RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 880 MPQ: 1
|
SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU DUAL CORE 3MB FLA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | e200z4 | 178 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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NXP 32-BIT MCU DUAL CORE 3MB FLA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | e200z4 | 178 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 13 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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|
|
Texas Instruments |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 64 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
|
|
|
Texas Instruments |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 144LQFP
|
Tray | Automotive，AEC-Q100，Hercules TMS570 ARM Cortex-R | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 58 | 256K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | External | CANbus，EBI/EMI，FlexRay，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH 384 RAM
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | |||
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|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | |||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tray | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
SINGLE CORE 3M FLASH
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit |
