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Discover 17 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Program Memory Type | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Program Memory Type | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Renesas Electronics America |
70
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 208LQFP
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 208-LQFP | 208-LQFP (28x28) | DMA，POR，PWM，WDT | SH-3 | 105 | 32K x 8 | - | ROMless | 1.4 V ~ 1.6 V | A/D 4x10b | Internal | EBI/EMI，FIFO，IrDA，SCI，USB | ||
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Infineon Technologies |
Inquiry
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-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 128K x 8 | 2MB (2M x 8) | Flash | 1.42 V ~ 1.58 V | A/D 4x10b，32x12b | External | ASC，CANbus，MLI，MSC，SSC | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 72 MPQ: 1
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IC MCU 32BIT ROMLESS 208LQFP
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 208-LQFP | 208-LQFP (28x28) | DMA，POR，WDT | SH-3 | 96 | 16K x 8 | - | ROMless | 1.65 V ~ 2.05 V | A/D 8x10b; D/A 2x8b | Internal | EBI/EMI，FIFO，IrDA，SCI，SmartCard | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 240 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tray | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 128K x 8 | 2MB (2M x 8) | Flash | 1.42 V ~ 1.58 V | A/D 4x10b，32x12b | External | ASC，CANbus，MLI，MSC，SSC | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 152 MPQ: 1
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IC MCU 32BIT ROMLESS 240LFBGA
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 240-LFBGA | 240-LFBGA (13x13) | DMA，POR，WDT | SH-3 | 96 | 16K x 8 | - | ROMless | 1.65 V ~ 2.05 V | A/D 8x10b; D/A 2x8b | Internal | EBI/EMI，FIFO，IrDA，SCI，SmartCard | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT ROMLESS 208LQFP
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 208-LQFP | 208-LQFP (28x28) | DMA，POR，WDT | SH-3 DSP | 96 | 32K x 8 | - | ROMless | 1.65 V ~ 1.95 V | A/D 8x10b; D/A 2x8b | Internal | EBI/EMI，FIFO，IrDA，SCI，SmartCard | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT ROMLESS 256LFBGA
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 256-LFBGA | 256-LFBGA (17x17) | DMA，LCD，POR，WDT | SH-3 DSP | 117 | 16K x 8 | - | ROMless | 1.4 V ~ 1.6 V | A/D 4x10b; D/A 2x8b | Internal | FIFO，I2C，IrDA，Memory Card，SCI，SD，SIO，SIM，USB | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 1MB FLASH 176LQFP
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Tape & Reel (TR) | TC116x | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 128K x 8 | 1MB (1M x 8) | Flash | 1.42 V ~ 1.58 V | A/D 32x12b | External | ASC，CANbus，EBI/EMI，MLI，MSC，SSC | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 176LQFP
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 128K x 8 | 2MB (2M x 8) | Flash | 1.42 V ~ 1.58 V | A/D 4x10b，32x12b | External | ASC，CANbus，MLI，MSC，SSC | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 240 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tray | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA，POR，WDT | TriCore | 88 | 128K x 8 | 2MB (2M x 8) | Flash | 1.42 V ~ 1.58 V | A/D 4x10b，32x12b | External | ASC，CANbus，MLI，MSC，SSC | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 126 MPQ: 1
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IC MCU 32BIT ROMLESS 196MAPBGA
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Tray | MCF527x | 0°C ~ 70°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，WDT | Coldfire V2 | 61 | 64K x 8 | - | ROMless | 1.4 V ~ 1.6 V | - | External | EBI/EMI，Ethernet，I2C，SPI，UART/USART，USB | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 126 MPQ: 1
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IC MCU 32BIT ROMLESS 256MAPBGA
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Tray | MCF527x | 0°C ~ 70°C (TA) | 256-LBGA | 256-MAPBGA | DMA，WDT | Coldfire V2 | 69 | 64K x 8 | - | ROMless | 1.4 V ~ 1.6 V | - | External | EBI/EMI，Ethernet，I2C，SPI，UART/USART，USB | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 126 MPQ: 1
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IC MCU 32BIT ROMLESS 196MAPBGA
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Tray | MCF527x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，WDT | Coldfire V2 | 61 | 64K x 8 | - | ROMless | 1.4 V ~ 1.6 V | - | External | EBI/EMI，Ethernet，I2C，SPI，UART/USART，USB | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 126 MPQ: 1
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IC MCU 32BIT ROMLESS 256MAPBGA
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Tray | MCF527x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，WDT | Coldfire V2 | 69 | 64K x 8 | - | ROMless | 1.4 V ~ 1.6 V | - | External | EBI/EMI，Ethernet，I2C，SPI，UART/USART，USB | ||
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Renesas Electronics America |
24
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 208QFP
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 208-QFP | - | - | SH-3 | 96 | 16K x 8 | - | ROMless | - | A/D 8x10b; D/A 2x8b | Internal | - | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 300 MPQ: 1
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IC MCU 32BIT ROMLESS 144LQFP
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Tray | MCF524x | 0°C ~ 70°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，I2S，POR，Serial Audio，WDT | Coldfire V2 | 34 | 96K x 8 | - | ROMless | 3 V ~ 3.6 V | A/D 4x12b | External | I2C，IDE，Memory Card，SPI，UART/USART | |||
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Renesas Electronics America |
Inquiry
|
- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT ROMLESS 208LQFP
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Tray | SuperH SH7700 | -20°C ~ 75°C (TA) | 208-LQFP | - | - | SH-3 DSP | 96 | 32K x 8 | - | ROMless | - | A/D 8x10b; D/A 2x8b | Internal | - |
