- Packaging:
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- Package / Case:
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- Supplier Device Package:
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- RAM Size:
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- Program Memory Size:
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- Data Converters:
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- Connectivity:
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- Selected conditions:
Discover 8 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 516FBGA
|
Tray | 516-BBGA | 516-FPBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | 416-BBGA | 416-PBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
3M FLASH 256K RAM Z7 200MHZ
|
Tape & Reel (TR) | 416-BBGA | 416-PBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | 416-BBGA | 416-PBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
3M FLASH 256K RAM Z7 200MHZ
|
Tray | 416-BBGA | 416-PBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | 516-BBGA | 516-FPBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | 516-BBGA | 516-FPBGA (27x27) | 32 | 192K x 8 | 3MB (3M x 8) | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 324TEBGA
|
Tray | 324-BBGA | 324-TEPBGA (23x23) | 22 | 256K x 8 | 4MB (4M x 8) | A/D 48x12b | CANbus,SCI,SPI |