- Manufacturer:
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- Operating Temperature:
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- Supplier Device Package:
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- Peripherals:
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- Program Memory Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Selected conditions:
Discover 69 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
Microchip Technology |
988
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
NXP USA Inc. |
3,814
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | LPC54100 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 100MHz | 192K x 8 | 256KB (256K x 8) | 1.62 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART,USB | ||||
NXP USA Inc. |
192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 32K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b,D/A 1x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
171
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 24K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH LQFP 64
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 32K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
156
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 24K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b,D/A 1x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
154
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 16K x 8 | 64KB (64K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 16K x 8 | 64KB (64K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b,D/A 1x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | LPC54100 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 100MHz | 96K x 8 | 128KB (128K x 8) | 1.62 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 24K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b,D/A 1x12b | CANbus,I2C,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,LVD,POR,PWM,WDT | 168MHz | 32K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 29x12b,D/A 1x12b | CANbus,I2C,SPI,UART/USART | ||||
Microchip Technology |
3,500
|
3 days |
-
|
MOQ: 3500 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
5,238
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Cut Tape (CT) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
5,238
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
- | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
530
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB | ||||
Microchip Technology |
515
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64TQFP
|
Tray | SAM4L | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 48MHz | 32K x 8 | 256KB (256K x 8) | 1.68 V ~ 3.6 V | A/D 7x12b,D/A 1x10b | I2C,IrDA,LINbus,SPI,UART/USART,USB | ||||
Microchip Technology |
327
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64TQFP
|
Tray | SAM4L | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 48MHz | 32K x 8 | 128KB (128K x 8) | 1.68 V ~ 3.6 V | A/D 7x12b,D/A 1x10b | I2C,IrDA,LINbus,SPI,UART/USART,USB | ||||
Microchip Technology |
713
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA,I2S,POR,PWM,WDT | 120MHz | 176K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | I2C,SPI,UART/USART,USB |