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Discover 134 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Infineon Technologies |
135
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 144LQFP
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Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 352K x 8 | 2MB (2M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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Infineon Technologies |
386
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 352K x 8 | 2MB (2M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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NXP USA Inc. |
1,800
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,280
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
534
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
925
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
300
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
838
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
466
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
370
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
297
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
300
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16-BIT MCU S12X CORE 512KB FLA
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Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
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Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 276K x 8 | 1.5MB (1.5M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 276K x 8 | 1.5MB (1.5M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 352K x 8 | 2MB (2M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
|
|
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NXP USA Inc. |
300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
|
|
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Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 200K x 8 | 1MB (1M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 276K x 8 | 1.5MB (1.5M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
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Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | PG-LQFP-144-24 | DMA，I2S，LED，POR，Touch-Sense，WDT | ARM Cortex-M4 | 144MHz | 200K x 8 | 1MB (1M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，MMC/SD，SPI，UART/USART，USB OTG，USIC | 32-Bit |
