- Packaging:
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- Operating Temperature:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Data Converters:
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- Oscillator Type:
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- Selected conditions:
Discover 25 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
2,280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
534
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
466
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
370
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b,16x10b | External | CANbus,EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 600 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 600 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b,16x10b | External | CANbus,EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 16K x 8 | 256KB (256K x 8) | 2K x 8 | A/D 8x10b,16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tray | -40°C ~ 85°C (TA) | 16K x 8 | 256KB (256K x 8) | 2K x 8 | A/D 8x10b,16x10b | Internal | CANbus,I2C,SCI,SPI |