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Discover 51 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
963
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
840
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
287
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
510
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
111
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 8K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 25MHz | 2K x 8 | 64KB (64K x 8) | 1K x 8 | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
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|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 8x10b，16x10b | External | CANbus，I2C，SCI，SPI | ||
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|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR，PWM，WDT | HCS12 | 25MHz | 2K x 8 | 64KB (64K x 8) | 1K x 8 | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 25MHz | 4K x 8 | 128KB (128K x 8) | 1K x 8 | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | POR，PWM，WDT | HCS12 | 25MHz | 4K x 8 | 128KB (128K x 8) | 1K x 8 | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI |
