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- Voltage - Supply (Vcc/Vdd)：
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Discover 185 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
1,852
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 1MB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 64K x 8 | 1MB (1M x 8) | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
432
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 1MB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 64K x 8 | 1MB (1M x 8) | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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|
NXP USA Inc. |
963
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
NXP USA Inc. |
1,192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
1,382
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 16K x 8 | 256KB (256K x 8) | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 14K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
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NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
542
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Cut Tape (CT) | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
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|
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NXP USA Inc. |
542
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
- | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
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NXP USA Inc. |
433
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 32K x 8 | 512KB (512K x 8) | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
|
|
|
NXP USA Inc. |
840
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
287
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 20K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
923
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
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NXP USA Inc. |
510
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
363
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 25MHz | 14K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
111
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 80MHz | 32K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
193
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM，WDT | HCS12 | 25MHz | 12K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 50MHz | 16K x 8 | 256KB (256K x 8) | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI |
