- Manufacturer:
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- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- RAM Size:
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Discover 87 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
1,021
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | HCS12 | 25MHz | 16K x 8 | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
1,192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
1,382
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 50MHz | 16K x 8 | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 14K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
433
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
840
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 16K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
923
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 16K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 12K x 8 | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 50MHz | 16K x 8 | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
272
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 16K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | HCS12 | 25MHz | 16K x 8 | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 12K x 8 | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 50MHz | 16K x 8 | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 16K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 12K x 8 | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 12K x 8 | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI |