Discover 8 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package Speed Connectivity
SPC5673FF3MVY2
NXP USA Inc.
40
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 3MB FLASH 516FBGA
Tray 516-BBGA 516-FPBGA (27x27) 200MHz CANbus,EBI/EMI,SCI,SPI
SPC5673FF3MVR2R
NXP USA Inc.
Inquiry
-
-
MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) 416-BBGA 416-PBGA (27x27) 200MHz CANbus,SCI,SPI
SPC5673FK0MVR2R
NXP USA Inc.
Inquiry
-
-
MOQ: 500  MPQ: 1
3M FLASH 256K RAM Z7 200MHZ
Tape & Reel (TR) 416-BBGA 416-PBGA (27x27) 200MHz CANbus,SCI,SPI
SPC5673FF3MVR2
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray 416-BBGA 416-PBGA (27x27) 200MHz CANbus,SCI,SPI
SPC5673FK0MVR2
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
3M FLASH 256K RAM Z7 200MHZ
Tray 416-BBGA 416-PBGA (27x27) 200MHz CANbus,SCI,SPI
SPC5673FK0MVY2R
NXP USA Inc.
Inquiry
-
-
MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) 516-BBGA 516-FPBGA (27x27) 200MHz CANbus,EBI/EMI,SCI,SPI
SPC5673FF3MVR3
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
IC MCU 32BIT 3MB FLASH 416BGA
Tray 416-BBGA 416-PBGA (27x27) 264MHz CANbus,SCI,SPI
SPC5673FK0MVY2
NXP USA Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray 516-BBGA 516-FPBGA (27x27) 200MHz CANbus,EBI/EMI,SCI,SPI