- Operating Temperature:
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- Speed:
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Discover 99 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
9,292
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
5,104
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20DIP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-DIP (0.300",7.62mm) | 20-DIP | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 20TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,502
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20SOIC
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
3,354
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20SOIC
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
3,354
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20SOIC
|
- | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
3,082
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
586
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20DIP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-DIP (0.300",7.62mm) | 20-DIP | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,717
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20TSSOP
|
Tube | S08 | -40°C ~ 125°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 20TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 40MHz | 1K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
Cypress Semiconductor Corp |
6,614
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC ANALOG
|
Tray | F2MC-8FX MB95560H | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOP | F2MC-8FX | 16MHz | 496 x 8 | 12KB (12K x 8) | - | 2.4 V ~ 5.5 V | A/D 6x8/10b | External | LINbus,UART/USART | ||||
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
2,450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
992
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
992
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20SOIC
|
- | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
Cypress Semiconductor Corp |
2,494
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 12KB FLASH 20TSSOP
|
Bulk | 8FX MB95260H | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | F2MC-8FX | 16MHz | 496 x 8 | 12KB (12K x 8) | - | 2.4 V ~ 5.5 V | A/D 6x8/10b | External | LINbus,SIO,UART/USART | ||||
NXP USA Inc. |
1,034
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 20DIP
|
Tube | S08 | -40°C ~ 125°C (TA) | 20-DIP (0.300",7.62mm) | 20-DIP | S08 | 40MHz | 512 x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI | ||||
NXP USA Inc. |
35
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | S08 | 40MHz | 256 x 8 | 4KB (4K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x10b | Internal | I2C,LINbus,SCI,SPI |