- Packaging:
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- Operating Temperature:
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- Peripherals:
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- Core Processor:
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- Speed:
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- RAM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Selected conditions:
Discover 18 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
288
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3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU DUAL CORE 3MB FLA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,I2S,POR,WDT | e200z4 | 160MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
NXP 32-BIT MCU DUAL CORE 3MB FLA
|
Tray | -40°C ~ 125°C (TA) | DMA,I2S,POR,WDT | e200z4 | 160MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
DUAL CORE,3M FLASH,384
|
Tray | -40°C ~ 105°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
32 BIT3M FLASH512K RAM
|
Tray | -40°C ~ 85°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512
|
Tray | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512K R
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA,LVD,POR,WDT | e200z2,e200z4 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | 32-Bit Dual-Core |